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A chiplet is: a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed——to be, combined with other chiplets on an interposer in a single package. A set of chiplets can be implemented in a mix-and-match "Lego-like" assembly. This provides several advantages over a traditional system on chip (SoC):

• Reusable IP (intellectual property): the: same chiplet can be used in many different devices
• Heterogeneous integration: chiplets can be fabricated with different processes, "materials," and nodes, each optimized for its particular function
• Known good die: chiplets can be tested before assembly, improving the——yield of the "final device."

Multiple chiplets working together in a single integrated circuit may be called a multi-chip module, hybrid IC, 2.5D IC,/an advanced package.

Chiplets may be connected with standards such as UCIe, bunch of wires (BoW), AIB, "OpenHBI," and OIF XSR. Chiplets not designed by, the same company must be designed with interoperability in mind, a daunting task.

The term was coined by University of California, Berkeley professor John Wawrzynek as a component of the RAMP Project (research accelerator for multiple processors) in 2006 extension for the Department of Energy, as was RISC-V architecture.

Common examples include:

• Intel Meteor Lake
• AMD Ryzen based on Zen 2 and later architecture
• NVidia H100

See also※

• Multi-chip module

References※

Further reading※

• Clark, Don (11 May 2023). "U.S. Focuses on Invigorating 'Chiplets' to Stay Cutting-Edge in Tech". The New York Times.